VII International Congress on Architectural Envelopes

Castellano | English

Donostia - San Sebastián 27 - 28 - 29 May 2015

VII International Congress on Architectural Envelopes

Topics

Participants are invited to submit abstracts (in English) to a maximum of 300 words befote February 15, 2012

Abstracts must include title, main content and keywords. On the cover of the document must include the names of the authors, article title, organization and contact information.

The summary will be send to the following email address: julen.astudillo@tecnalia.com

Abstracts are invited in the following broad areas:

  • New Materials for Light Facades
  • Sustainability
  • Wind
  • Energy Efficiency - Thermal Storage
  • Photovoltaic systems - Solar Impounding
  • Exposure to the sun
  • Life Cycle
  • Noise Insulation
  • New Technologies for Light enclosures (curtain walls, ventilated facades, etc.)
  • New Technologies related to glass for buildings (layers, structural glass, etc.)
  • Industrialized Construction related to building envelopes
  • Safety in Light facades (fire, seismic risk, blasts, etc.)