VII International Congress on Architectural Envelopes

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Donostia - San Sebastián 27 - 28 - 29 May 2015

VII International Congress on Architectural Envelopes
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ICAE 2015 showcased an amazing array of technology developments on Architectural Envelopes
Attended by more than 300 participants and with more than 70 lecturers.

The VII International Congress of Architectural Envelopes´ (ICAE 2015) took place successfully on the 27th to 29th May 2015 – at Kursaal Congress Palace in Donostia – San Sebastian (Spain). The congress was organized by the TECNALIA and was attended by more than 300 participants. ICAE 2015 showcased an amazing array of technology developments with more than 70 lecturers.

TECNALIA organizes this international congress every three years, completing its offering a comprehensive relationship as technological partner for the industries on development, characterisation and performance assessment of architectural envelopes.

Photo Album

 Report from #ICAE2015


The Future of Building Envolopes According to Experts #ICAE2015

 
Lecture of Dr. Lorenzo Valles from the European Commission
“Energy–Efficient Buildings in the European R&D Programme" #ICAE2015

Julen Astudillo
Head of ICAE´s organizing committee
TECNALIA Research & Innovation